$800B
Global semiconductor market
Growing at 12% CAGR
Series A — Open Now
Own the architecture that owns the next decade.
Revolution Silicon is building the first ground-up chip architecture since ARM. Seven silicon platforms. One proprietary ISA. We are at Day Zero — raising our first round to fund the architecture that owns the next decade.
"Every great chip company started with zero funding and a belief that the world needed a better architecture. We are that company."
The window is open — briefly.
We are raising our first round. No prior funding. No legacy. Just the architecture, the team, and the conviction that the next great chip company starts here.
Pre-seed · Raising
Round status
$0 raised
Prior funding
Complete
Architecture
Assembled
Team
The market is enormous. The gap is real.
Legacy silicon was designed for a world that no longer exists. The transition to AI-native, edge-native, and autonomous compute is creating a once-in-a-generation opening for a new architecture.
40%
CAGR in AI chips
Fastest-growing segment
$2T
Cloud infrastructure spend
By 2030
0
Dominant next-gen ISA players
The gap we fill
Four unfair advantages
01
Proprietary ISA
RSVC is not a fork of x86 or ARM. It is a ground-up instruction set designed for AI-native, parallel, and edge workloads — with no legacy tax.
02
10 TB/s interconnect
Die-to-die bandwidth that makes multi-chip systems behave like a single processor. Scale without the latency penalty.
03
Native AI acceleration
Tensor compute is not bolted on — it is embedded in the hardware foundation. Every core is AI-aware from the first clock cycle.
04
Silicon-level security
Cryptographic memory tagging and secure enclave execution are baked into every layer of the RSVC architecture — not patched in firmware.
Seven platforms. One architecture.
Each chip targets a distinct, high-value market. All share the RSVC ISA, toolchain, and interconnect — compounding the moat with every product shipped.
Server & Cloud
Hyperscale infrastructure, AI training, and HPC — the highest-ASP segment in the market.
The team that can execute
Chief Executive Officer
CEO & Co-founder
ex-Intel Fellow · 22 years in silicon
Led architecture for three generations of server CPUs. Holds 34 patents in processor design. Built and scaled teams of 400+ engineers across two continents.
Chief Technology Officer
CTO & Co-founder
ex-ARM Chief Architect
Principal architect of ARMv9. Designed the ISA extensions now shipping in 15 billion devices. Left to build the architecture that replaces it.
VP Engineering
VP Engineering
ex-TSMC Advanced Packaging
Ran advanced packaging programs at TSMC for three of the world's largest chip companies. Knows exactly how to get silicon from tape-out to mass production.
Chief Financial Officer
CFO
ex-Goldman Sachs TMT
Advised on $40B+ in semiconductor M&A and IPOs. Joined Revolution Silicon to run the financial architecture of the company, not just advise it.
Milestones & roadmap
From founding in 2024 to architecture dominance in 2030 — every milestone on the path to owning the next decade of compute.
Complete In progress Upcoming
- Done
Company Founded
2024
Revolution Silicon incorporated. Core founding team assembled — ex-Intel, ex-ARM, ex-TSMC. RSVC ISA design begins.
- Done
Architecture Complete
Early 2025
RSVC instruction set architecture finalized. Proprietary ISA, 10 TB/s die-to-die interconnect spec, and native tensor compute model locked.
- Done
Seven-Platform Vision
Mid 2025
Full chip lineup defined: R1, G1, A1, D1, L1, V1, X1. One architecture. Seven markets. Toolchain and compiler foundation underway.
- Done
Team Assembled
Late 2025
Leadership team complete. 40+ engineers across silicon design, firmware, and systems software. IP portfolio initiated.
- Now
Seed Round
Target: 2026
Raising first institutional capital. Funds RTL design, EDA tooling, and first TSMC shuttle runs. This is Day Zero — the window is open.
RTL Design & Simulation
2026
Full register-transfer level design for R1 and A1 lead chips. Simulation, verification, and formal proof of RSVC core pipeline.
Series A
Target: 2027
Scale engineering to 150+ headcount. Fund full tape-out across all seven platforms. Engage tier-1 cloud and automotive customers.
Tape-out
Target: Q2 2027
First silicon submitted to TSMC 3nm / 2nm process nodes. R1 server CPU and A1 AI accelerator lead the tape-out sequence.
Silicon Validation
Target: Q4 2027
First physical chips back from fab. Bring-up, validation, and benchmark against x86 and ARM reference platforms.
Customer Samples
Target: Q1 2028
Engineering samples to anchor cloud, automotive, and defense customers. Design-win pipeline opens. SDK and toolchain released.
Mass Production
Target: Q4 2028
Volume ramp with TSMC. First revenue. RSVC architecture enters production across server, drone, and vehicle markets simultaneously.
Full Lineup Live
2029
All seven chips — R1 through X1 — in production. RSVC ecosystem: compilers, OS kernels, cloud SDKs, and automotive stacks shipping.
RSVC Ecosystem Dominance
2030+
The architecture that owns the next decade. RSVC becomes the default ISA for AI-native, edge-native, and autonomous compute worldwide.
The architecture that owns the next decade.
From Day Zero in 2024 to global compute dominance by 2030. This is the window. This is the moment.
Join the revolutionPress releases
ArchitectureJuly 2026
Revolution Silicon Announces RSVC Architecture — The First Ground-Up ISA Since ARM
Revolution Silicon today unveiled the RSVC instruction set architecture, a ground-up processor design built natively for AI, edge, and autonomous compute. The company simultaneously announced seven silicon platforms — R1 through X1 — all sharing the same ISA, toolchain, and 10 TB/s die-to-die interconnect.
CompanyJune 2026
Revolution Silicon Assembles World-Class Founding Team from Intel, ARM, and TSMC
Revolution Silicon has completed its founding team, bringing together a former Intel Fellow with 34 processor patents, the principal architect of ARMv9, a TSMC advanced packaging lead, and a Goldman Sachs semiconductor M&A veteran. The team is now fully assembled and architecture work is underway.
FundingMay 2026
Revolution Silicon Raises Pre-Seed Round to Fund RSVC Silicon Development
Revolution Silicon is raising its first institutional round to fund RTL design, EDA tooling, and initial TSMC shuttle runs for the RSVC architecture. The company is targeting a seed close in 2026 and first tape-out in Q2 2027. Investor briefings are available on request.
INVESTOR BRIEFINGS
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